The Tokyo Electric Power Company, Incorporated (the "Company") hereby notifies all interested 
parties that the Company has decided the following outline of issuance of its 566th and 567th 
domestic straight corporate bond. The terms of the issues are as follows:

[Outline of Issue]
1. The Tokyo Electric Power Company, Incorporated's 566th Domestic Straight Corporate Bond
(1) Name of the bond            The Tokyo Electric Power Company, Incorporated 
                                566th Domestic Straight Corporate Bond
                                (with general mortgage)
(2) Aggregate amount            30 billion yen
(3) Date of issue               July 29, 2010
(4) Coupon rate                 1.222 % 
(5) Issue price                 100 yen per par value of 100 yen
(6) Mortgage                    General Mortgage
(7) Interest payment date       January 29 and July 29 every year 
(8) Redemption date             July 29, 2020
                                (10-year period: bullet maturity)
(9) Yield on the bond           1.222 %
(10) Denomination value         1 million yen
(11) Schedule
      Announcement date          July 7, 2010 (Wednesday)  
      Offering period            July 7, 2010 (Wednesday) 
      Payment due date           July 29, 2010 (Thursday) 
(12) Lead managing underwriter
                                Mizuho Securities Co., Ltd. 
                                Nikko Cordial Securities Inc.
                                Nomura Securities Co., Ltd. 
                                BNP Paribas Securities (Japan) Limited
                                Merrill Lynch Japan Securities Co., Ltd. 

2. The Tokyo Electric Power Company, Incorporated's 567th Domestic Straight Corporate Bond
(1) Name of the bond            The Tokyo Electric Power Company, Incorporated 
                                567th Domestic Straight Corporate Bond
                                (with general mortgage)
(2) Aggregate amount            20 billion yen
(3) Date of issue               July 29, 2010
(4) Coupon rate                 1.958 %
(5) Issue price                 100 yen per par value of 100 yen
(6) Mortgage                    General Mortgage
(7) Interest payment date       January 29 and July 29 every year 
(8) Redemption date             July 29, 2030 
                                (20-year period: bullet maturity)
(9) Yield on the bond           1.958 %
(10) Denomination value         1 million yen
(11) Schedule
      Announcement date          July 7, 2010 (Wednesday)   
      Offering period            July 7, 2010 (Wednesday)   
      Payment due date           July 29, 2010 (Thursday) 
(12) Lead managing underwriter
                                Daiwa Securities Capital Markets Co. Ltd.
                                Nikko Cordial Securities Inc. 
                                Mitsubishi UFJ Morgan Stanley Securities Co., Ltd. 
                                UBS Securities Japan Ltd 

(note 1)
This press release is for public announcement, not a canvass for investors.

(note 2) 
Please note that the above purports to be an accurate and complete translation of 
the original Japanese version prepared for the convenience of our English-speaking 
audience. However, in the case of any discrepancy between the translation and the 
Japanese original, the latter shall prevail.