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Corporate Information

 
Press Release (May 14,2010)
Announcement on Issue of The Tokyo Electric Power Company, Incorporated's 563rd Corporate Bond (10-Year Bond) and 564th Corporate Bond (30-Year Bond)
The Tokyo Electric Power Company, Incorporated (the "Company") hereby notifies all interested 
parties that the Company has decided the following outline of issuance of its 563rd and 564th 
domestic straight corporate bond. The terms of the issues are as follows:

[Outline of Issue]
1. The Tokyo Electric Power Company, Incorporated's 563rd Domestic Straight Corporate Bond
(1) Name of the bond            The Tokyo Electric Power Company, Incorporated 
                                563rd Domestic Straight Corporate Bond
                                (with general mortgage)
(2) Aggregate amount            30 billion yen
(3) Date of issue               May 28, 2010
(4) Coupon rate                 1.39 % 
(5) Issue price                 100 yen per par value of 100 yen
(6) Mortgage                    General Mortgage
(7) Interest payment date       May 28 and November 28 every year 
(8) Redemption date             May 28, 2020 
                                (10-year period: bullet maturity)
(9) Yield on the bond           1.39 %
(10) Denomination value         1 million yen
(11) Schedule
     Announcement date          May 14, 2010 (Friday) 
     Offering period            May 14, 2010 (Friday)
     Payment due date           May 28, 2010 (Friday) 
(12) Lead managing underwriter
                                Nikko Cordial Securities Inc.
                                Nomura Securities Co., Ltd.
                                BNP Paribas Securities (Japan) Limited
                                Merrill Lynch Japan Securities Co., Ltd. 
                                UBS Securities Japan Ltd

2. The Tokyo Electric Power Company, Incorporated's 564th Domestic Straight Corporate Bond
(1) Name of the bond            The Tokyo Electric Power Company, Incorporated 
                                564th Domestic Straight Corporate Bond
                                (with general mortgage)
(2) Aggregate amount            25 billion yen
(3) Date of issue               May 28, 2010
(4) Coupon rate                 2.366 %
(5) Issue price                 100 yen per par value of 100 yen
(6) Mortgage                    General Mortgage
(7) Interest payment date       May 28 and November 28 every year 
(8) Redemption date             May 28, 2040 
                                (30-year period: bullet maturity)
(9) Yield on the bond           2.366 %
(10) Denomination value         1 million yen
(11) Schedule
     Announcement date          May 14, 2010 (Friday) 
     Offering period            May 14, 2010 (Friday) 
     Payment due date           May 28, 2010 (Friday) 
(12) Lead managing underwriter
                                Daiwa Securities Capital Markets Co. Ltd.
                                Mizuho Securities Co., Ltd.
                                Nikko Cordial Securities Inc.
                                Nomura Securities Co.,Ltd.
                                Mitsubishi UFJ Morgan Stanley Securities Co., Ltd.
                                Goldman Sachs Japan Co.,Ltd. 

(note 1)
This press release is for public announcement, not a canvass for investors.

(note 2) 
Please note that the above purports to be an accurate and complete translation of 
the original Japanese version prepared for the convenience of our English-speaking 
audience. However, in the case of any discrepancy between the translation and the 
Japanese original, the latter shall prevail.

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