The Tokyo Electric Power Company, Incorporated (the "Company") hereby notifies all interested 
parties that the Company has decided the following outline of issuance of its 545th and 546th 
domestic straight corporate bond.  The terms of the issues are as follows:

[Outline of Issue]
1. The Tokyo Electric Power Company, Incorporated's 545th Domestic Straight Corporate Bond
(1) Name of the bond            The Tokyo Electric Power Company, Incorporated 
                                545th Domestic Straight Corporate Bond
                                (with general mortgage)
(2)  Aggregate amount           50 billion yen
(3)  Date of issue              July 25, 2008 
(4)  Coupon rate                1.849 % 
(5)  Issue price                100 yen per par value of 100 yen
(6)  Mortgage                   General Mortgage
(7)  Interest payment date      January 25 and July 25 every year
(8)  Redemption date            July 25, 2018
                                (10-year period: bullet maturity)
(9)  Yield on the bond          1.849 %
(10) Denomination value         1 million yen
(11) Schedule
     Announcement date          July 4, 2008 (Friday) 
     Offering period            July 4, 2008 (Friday) 
     Payment due date           July 25, 2008 (Friday)
(12) Lead managing underwriter
                                Daiwa Securities SMBC Co. Ltd. 
                                Nikko Citigroup Limited 
                                BNP PARIBAS Securities (Japan) Limited


2. The Tokyo Electric Power Company, Incorporated's 546th Domestic Straight Corporate Bond
(1)  Name of the bond           The Tokyo Electric Power Company, Incorporated 
                                546th Domestic Straight Corporate Bond
                                (with general mortgage)
(2)  Aggregate amount           50 billion yen
(3)  Date of issue              July 22, 2008 
(4)  Coupon rate                1.505 % 
(5)  Issue price                100 yen per par value of 100 yen
(6)  Mortgage                   General Mortgage
(7)  Interest payment date      January 22 and July 22 every year
(8)  Redemption date            July 22, 2014
                                (6-year period: bullet maturity)
(9)  Yield on the bond          1.505 %
(10) Denomination value         1 million yen
(11) Schedule
     Announcement date          July 4, 2008 (Friday) 
     Offering period            July 4, 2008 (Friday) 
     Payment due date           July 22, 2008 (Tuesday)
(12) Lead managing underwriter
                                Mizuho Securities Co., Ltd. 
                                Nikko Citigroup Limited 
                                Shinko Securities Co., Ltd. 

Please note that the above purports to be an accurate and complete translation of the original 
Japanese version prepared for the convenience of our English-speaking audience.  However, in 
the case of any discrepancy between the translation and the Japanese original, the latter shall 
prevail.